Description
AMD RYZEN™ 9 7900X3D GAMING PROCESSOR
- The Ultimate Processor for Gaming, with AMD 3D V-Cache™ Technology for Even More Game Performance
- The 16-core processor can do it all with an incredible performance AMD for the most demanding gamers and creators. Plus, enjoy the benefits of next-gen AMD 3D V-Cache™ technology for low latency and even more game performance.
- 12 Cores & 24 Threads, 128 MB Cache, 5nm ‘Zen 4’ Architecture
- Memory Support: DDR5 Up to 5200 MHz, Memory Channels: 2, TDP: 120 W
- Compatible with Motherboards based on 600 series chipset, Socket AM5, Windows 11 Compatible
- Graphics: AMD Radeon Graphics, Included Heatsink Fan: No
- AMD Technologies: AMD EXPO Technology, AMD Ryzen Technologies
- 3 Years Brand Warranty.
SPECIFICATION
| Platform | Desktop |
| Market Segment | Enthusiast Desktop |
| Product Family | AMD Ryzen™ Processors |
| Product Line | AMD Ryzen™ 9 Processors |
| AMD PRO Technologies | No |
| Consumer Use | Yes |
| Regional Availability | Global |
| Former Codename | “Raphael AM5” |
| Architecture | “Zen 4” |
| # of CPU Cores | 12 |
| Multithreading (SMT) | Yes |
| # of Threads | 24 |
| Max. Boost Clock | Up to 5.6GHz |
| Base Clock | 4.4GHz |
| L1 Cache | 768KB |
| L2 Cache | 12MB |
| L3 Cache | 128MB |
| Default TDP | 120W |
| Processor Technology for CPU Cores | TSMC 5nm FinFET |
| Processor Technology for I/O Die | TSMC 6nm FinFET |
| CPU Compute Die (CCD) Size | 71mm² |
| I/O Die (IOD) Size | 122mm² |
| Package Die Count | 3 |
| AMD EXPO™ Memory Overclocking Technology | Yes |
| Precision Boost Overdrive | Yes |
| Curve Optimizer Voltage Offsets | Yes |
| AMD Ryzen™ Master Support | Yes |
| CPU Socket | AM5 |
| Supporting Chipsets |
|
| CPU Boost Technology | Precision Boost 2 |
| Instruction Set | x86-64 |
| Supported Extensions | AES, AMD-V, AVX, AVX2, AVX512, FMA3, MMX(+), SHA, SSE, SSE2, SSE3, SSE4.1, SSE4.2, SSE4A, SSSE3, x86-64 |
| Thermal Solution (PIB) | Not included |
| Recommended Cooler | Liquid cooler recommended for optimal performance |
| Max. Operating Temperature (Tjmax) | 89°C |
| Launch Date | 2/28/2023 |
| OS Support |
*Operating System (OS) support will vary by manufacturer. |
| USB Type-C® Support | Yes |
| Native USB 3.2 Gen 2 (10Gbps) Ports | 4 |
| Native USB 3.2 Gen 1 (5Gbps) Ports | 0 |
| Native USB 2.0 (480Mbps) Ports | 1 |
| Native SATA Ports | 0 |
| PCI Express® Version | PCIe® 5.0 |
| Native PCIe® Lanes (Total/Usable) | 28/24 |
| Additional Usable PCIe Lanes from Motherboard |
|
| NVMe Support | Boot, RAID0, RAID1, RAID10 |
| System Memory Type | DDR5 |
| Memory Channels | 2 |
| Max. Memory | 128GB |
| System Memory Subtype | UDIMM |
| Max Memory Speed |
|
| ECC Support | Yes (Requires mobo support) |
| Integrated Graphics | Yes |
| Graphics Model | AMD Radeon™ Graphics |
| Graphics Core Count | 2 |
| Graphics Frequency | 2200 MHz |
| USB Type-C® DisplayPort™ Alternate Mode | Yes |
| Product ID Boxed | 100-100000909WOF |
| Product ID Tray | 100-000000909 |
| Supported Technologies |
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